Mini screen printer
for rework of QFN- and BGA components

Repair equipment when solder cannot be applied to the PCB but has to be printed on the component instead.


  • Screening of paste to QFN or adding new solder balls to BGA components.
  • The component can be removed from the topside or underside.
  • Ideally using vacuum extraction if from the underside.

Included/Start kit

  • Mini screen printer and screen plate with required footprint
  • Brass plate insert for component placement
  • Thin shims to cope with thickness deviations

Available with and without bottom plug. With a bottom plug, the component can be removed via the underside by vacuum extraction.

For further information please contact our sales team for assistance:  

New sales representative
at CORE-emt A/S