What is AOI?
AGV Automated Guided Vehicle
AMF Auto Mount Feedback
AMR
Autonomous Mobile Robot
AOI Automated Optical Inspection
AXI
Automatic X-ray inspection
BGA Ball Grid Array - a type of SMD
BOM Bill Of Materials - files used for e.g. programming
CAD Computer-Aided Design
CAM Computer-Aided Manufacturing
CEM Contract Electronics Manufacturer
CONV Conveyor system
What does CPH stand for?
CPH Components Per Hour
Cpk Process Capability Index
CSP Chip Scale Package
CTQ
Critical To Quality
DFA Design For Assembly
DFM Design For Manufactures
DFT Design For Test
DPM
Defects Per Million Opportunities
ECAD
Electronic Computer-Aided Design
EDA Electronic Design Automation
EMC
Electromagnetic Compatibility
EMI Electromagnetic interference
EMT Electronic Manufacturing Technology
What does EMS mean?
EMS Electronic Manufacturing Service
EOL End Of Line test
ERP Enterprise Resource Planning
ESD Electrostatic Discharge
FAI First Article Inspection
FCT Functional Circuit Test
FEFO First Expired, First Out
FID Fiducial mark
FIFO First In, First Out
FOV Field of view
FPC Flexible Printed Circuit
HAL Hot Air Levelling
HASL Hot Air Solder Leveling
IC
Integrated Circuit
ICT In-Circuit Test
IIoT Industrial Internet of Things
IoT Internet of Things
IPC is short for?
IPC Institute for Printed Circuits. Global organization that develop standards for electronics manufacturing
IPC-A-610 Acceptability of Electronic Assemblies
IPC-7711 Rework, Modification and Repair
IPC-7721 Repair of Printed Boards and Assemblies
JEDEC Joint Electron Device Engineering Council
J-STD Joint Standard
J-STD-001 Requirements for soldered electrical and electronic assemblies
KPI Key Performance Indicator
LCC Leadless Chip Carrier
LCR Inductor, Capacitor & Resistor
LED Light emitting diode
LGA Land Grid Array
LQFP Low-profile Quad Flat Package
MES Manufacturing Execution System
MLCC Multilayer Ceramic Capacitor
MEMS Micro-Electro-Mechanical Systems
MPM Manufacturing Process Management
MRP Material Requirements Planning
MSL Moisture Sensitivity Level
MSD Moisture Sensitive Device
NPI New Product Introduction
ODM Original Design Manufacturer
OCV Optical Character Verification
OCR Optical Character Recognition
OEE Overall Equipment Effectiveness
What does OEM mean?
OEM Original Equipment Manufacturer
OSP
Organic Solderability Preservative
What is PCB short for?
PCB Printed Circuit Board
PCBA Printed Circuit Board Assembled
PGA Pin Grid Array
PLC Programmable Logic Controller
PLCC Plastic Leaded Chip Carrier
PoP Package on Package
Ppk Process Performance Index
PTH Plated Through Hole
PWB Printed Wiring Board
P&P
Pick & Place machines for SMD mounting
What is a QFP?
QFP Quad Flat Package
QFN
Quad Flat No-lead
REACH
Registration, Evaluation, Authorisation & Restriction of Chemicals
(a European regulation)
Reflow
Reflow soldering process
RMA Return Material Authorization
RFID Radio Frequency Identification
RoHS Restriction of Hazardous Substances
SAC Tin-Silver-Copper solder alloy
SiP System in Package
SIR Surface Insulation Resistance
SMA Surface-mount assembly (module assembled with SMT)
SMC Surface-mount components (components for SMT)
SME Surface-mount equipment (SMT assembling machines)
SMEMA Surface Mount Equipment Manufacturers Association
What does SMT mean?
SMT Surface Mount Technology
SMP Surface-mount packages (SMD case forms)
SOIC Small Outline Integrated Circuit
SOJ Small Outline J-leaded
SOP Small Outline Package
SOT Small Outline Transistor
SPC Statistical Process Control
SSOP Shrink Small Outline Package
Stencil
Stencil solder printing
Tg
Glass Transition Temperature
THT Through Hole Technology
THR Through-Hole Reflow (in connection with soldering)
TQFP Thin Quad Flat Package
TSOP
Thin Small Outline Package
UID Unique Identifier
UL Underwriters Laboratories
USP Uninterrupted Power
Supply
VOC Volatile Organic Compounds
VOC-free Volatile Organic Compounds Free
WAVE Wave soldering
WIP Work In Progress