Inline SPI machine | Solder Paste Inspection

Solder paste inspection 
SPI inspection

The Yamaha VP-01G-Y SPI inspect the solder paste printing quality inspecting solder paste height, volume, area and misalignments using advanced SPI technology such as warpage focus adjustment, automatic inspection feedback to printer to ensure highest print quality, automatic bad PCB marking feed-forward, automatic SPI setup changes and includes statistics process control.

This Yamaha SPI is a 1 head solution.

  - 3D + 2D solder paste inspection machine

About YAMAHA SPI inspection with the VP-01G-Y

YAMAHA solder paste inspection machine specifications

  • Performs various inspections with one single head

  • Applicable PCB: max. L 510 x W 510 mm to min. L 50 x W 50 mm

  • PCB thickness:  0,3 - 5,0 mm 

  • Field of view size, horizontal resolution:
    -
    25 μm / 12,5 μm on approx. 50 x 50 mm
    20 μm / 10 μm on approx. 40 x 40 mm
    15 μm / 7,5 μm
     on approx. 30 x 30 mm


  • Inspection speed standard / (high resolution) 
    - 25 μm / (12,5 μm) resolution:
    -> Twin projector inspection speed: 8,900 (5,600) mm2 /s
    -> Single projector inspection speed
    : 9,400 (6,000) mm2 /s  

    - 20 μm / (10 μm) resolution:
    -> Twin projector inspection speed: 5,700 (3,500) mm2 /s
    -> Single projector inspection speed: 6,000 (3,700) mm2 /s  

    - 15 μm / (7,5 μm) resolution:
    -> Twin projector inspection speed: 3,200 (1,900) mm2 /s
    -> Single projector inspection speed: 3,300 (2,000) mm2 /s 
  • Height resolution:  1 μm

  • Accuracy volume 3 σ:  
    - 2%  with twin projector 
    - 3% with single projector 

  • Machine size: L 938 mm x W 1.191 mm x H 1.480 mm

  • Machine weight: approx. 600 kg

VP-01G-Y flyer

Download the Yamaha SPI spec sheet and detailed explanation about the SPI features within the Yamaha VP-01G-Y.

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