SPI inspection with YAMAHA YSi-SP

YAMAHA SPI | Solder Paste Inspection machine

• Performs various inspections with one single head
  
  

• Applicable PCB: L 510 x W 460 mm (maximum) to L 50 x W 50 mm (minimum)

• PCB thickness:  0,3 - 5,0 mm
  
  

• Achieves high-accuracy high-speed inspections using 3D + 2D inspection,  image resolution switch-over and more*

• A thorough and extensive machine-to-machine (M2M) solution* 
  

• Statistical Process Control (SPC) for diverse statistical processing*

• Optional features to enable handling a wide range of SMT production line tasks*
  * Download spec sheet below to learn more
  
  

• Field of view size (horizontal resolution) and inspection speed at high resolution mode:
  - Approx. 50 x 50 mm:
      - 12,5 μm  |  Inspection speed: 8,900 (5,600) mm2 /s  (high-speed twin projector)   
      - 25 μm      |  Inspection speed: 9,400 (6,000) mm2 /s  (high-speed single projector)
  
  - Approx. 40 x 40 mm
      - 10 μm      |   Inspection speed: 5,700 (3,500) mm2 /s  (high-speed twin projector) 
      - 20 μm      |   Inspection speed: 6,000 (3,700) mm2 /s  (high-speed single projector)
  
  - Approx. 30 x 30 mm 
      - 7,5 μm    |   Inspection speed: 3,200 (1,900) mm2 /s  (high-speed twin projector)
      - 15 μm     |   Inspection speed: 3,300 (2,000) mm2 /s (high-speed single projector)
  

• Note that no air supply is needed.
  
  

• Machine size: L 904 mm x W 1.080 mm x H 1.478 mm

• Machine weigh: 550 kg