Solder Paste Inspection machine

  • Performs various inspections with one single head

  • Applicable PCB: L 510 x W 460 mm (maximum) to L 50 x W 50 mm (minimum)

  • PCB thickness:  0,3 - 5,0 mm

  • Achieves high-accuracy high-speed inspections using 3D + 2D inspection,  image resolution switch-over and more*

  • A thorough and extensive machine-to-machine (M2M) solution* 

  • Statistical Process Control (SPC) for diverse statistical processing*

  • Optional features to enable handling a wide range of SMT production line tasks*
    * Download spec sheet below to learn more

  • Field of view size (horizontal resolution) and inspection speed at high resolution mode:
    - Approx. 50 x 50 mm:
        - 12,5 μm  |  Inspection speed: 8,900 (5,600) mm2 /s  (high-speed twin projector)   
        - 25 μm      |  Inspection speed: 9,400 (6,000) mm2 /s  (high-speed single projector)

    - Approx. 40 x 40 mm
        - 10 μm      |   Inspection speed: 5,700 (3,500) mm2 /s  (high-speed twin projector) 
        - 20 μm      |   Inspection speed: 6,000 (3,700) mm2 /s  (high-speed single projector)

    - Approx. 30 x 30 mm 
        - 7,5 μm    |   Inspection speed: 3,200 (1,900) mm2 /s  (high-speed twin projector)
        - 15 μm     |   Inspection speed: 3,300 (2,000) mm2 /s (high-speed single projector)

  • Height resolution:  1 μm

  • Accuracy volume 3 σ:  within 2%  (twin projector)  |   within 3%  (single projector)

  • Note that no air supply is needed.

  • Machine size: L 904 mm x W 1.080 mm x H 1.478 mm

  • Machine weigh: 550 kg