New high-speed AOI from Yamaha SMT is released
Yamaha SMT announces that March 1st, 2024, they will release a new high-speed AOI - the YRi-V TypeHS - a 3D hybrid AOI system, that achieves both highest speed & precision in SMT inspection in any SMT line
New AOI innovation
The new high-speed AOI is 1.6 times faster & has a 25-megapixel high-resolution camera
YRi-V TypeHS has significantly improved image processing capability by adopting a high-resolution 25-megapixel camera, which is more than twice that of previous models, and the latest high-performance CPU and GPU applications. As a result, high-definition inspection with resolutions of 7 μm and 5 μm is approximately 1.6 times faster than previous models, making the new model one of the fastest in the industry*.
In addition to the conventional high-precision 8-direction 3D projector, a high-performance 3D line laser has been newly installed. By combining this with 3D projector images using the phase shift method, it is now possible to reproduce the shapes of specular and transparent components more accurately, further improving inspection capabilities.
This provides greater accuracy in detection capability for 008004" (0201 = 0.25mm x 0.125mm) sized ultra-small chips and specular-glossy components, further contributing to improved quality in module & device PCB production.
* 3D inspection speed 16.2 cm2/s with resolution 5 µm (Company optimal conditions when using 4 projectors: According to Yamaha Motor research as of January 18, 2024)
Yamaha's new 3D Hybrid AOI System; YRi-V TypeHS
New innovation
Yamaha YRi-V TypeHS specifications
Specifications & appearances of the
Yamaha YRi-V TypeHS may change without notice.
| Model | Yamaha YRi-V TypeHS |
| Camera pixels | 25 Megapixels |
|
Resolution &
3D inspection speed Description under Yamaha optimum conditions when using 4 projectors. |
7 µm = 30.5cm2/s 5 µm = 16.2cm2/s |
| 3D projector | 8 Projectors / 4 Projectors |
| 4-direction angle camera pixels | 20 Megapixels |
| Applicable PCB dimensions minimum to maximum | L 50 mm x W 50 mm to L 610 mm x W 610 mm * L 760 mm long-board compatible (optional) |
| PCB height that can be carried in | Top surface: 45 mm / Bottom surface: 85 mm * When selecting the 3D laser option, the height of parts that can be loaded onto the PCB is limited to 33 mm on the top surface. ** Description when using single lane. |
| Inspection lighting | Visible light (Red/Green/Blue), infra-red & coaxial |
| Inspection items | Status of components immediately after mounting Status of components and soldering after hardening |
| Power supply | Single phase AC 200-230V ±20V 50/60 Hz |
| Air supply | 0.45MPa or more, clean & dry state |
| External Dimensions excluding protrusions | L 1,252 mm x W 1,497 mm x H 1,614 mm |
| Weight approx. | 1.430 kg. |
Product outline & Market background
The Yamaha YRi-V TypeHS is created for the future
The reliability shown with SMT processes directly affects the market value of the products. The SMT field in recent years has seen the shift toward smaller sizes, higher densities, greater functionality, and more diversifications accelerate rapidly, and faster yet more precise inspection across all items by AOI systems will be even more sought after.
Also more recently, the use of thin and extremely small WLCSPs and FOWLPs*, which have specular gloss on the package surface, has risen significantly in the market. So, in addition to specular components that are difficult to inspect, the need for compatibility to mount ultra-small chips at narrow pitch is dramatically increasing.
In response to these market changes and demands, the YRi-V being developed and released in July 2021, Yamaha SMT has produced an AOI system that still is extremely fast and highly accurate, achieving accurate detection even for 008004" (0201) sized ultra-small chips and specular glossy components.
With the newly developed YRi-V TypeHS, featured in this article, you get a high-end AOI system that further refines the traditional features from the YRi-V such as inspection speed and specular component inspection abilities have been achieved.
*WLCSP = Wafer Level Chip Size Package FOWLP = Fan Out Wafer Level Package.
Yamaha SMT offers the unique concept of a 1 STOP SMART SOLUTION, as Yamaha is the industry's leading manufacturer of a full line-up of mounting equipment, including pick & place machines, solder paste printers, glue dispensers, inspection systems and the Intelligent Factory software that comprehensively improves the efficiency of the mounting process through smooth and advanced inter-equipment coordination without black boxes in equipment within the mounting line.