Akrometrix is a leading provider of metrology equipment and test services for determining thermal warpage and strain of semiconductor wafer, die, PCBs and packaging substrates. Their equipment and software solutions help the user to assess, using visual 2D and 3D graphical models as well as structured data, how your product reacts to reflow temperature cycles that the product is subject-to during assembly.
Warpage and Strain, when measured at room temperature, can only give a limited amount of root-cause data regarding defects. Defects such as shorts, opens, head-in-pillow and cold solder joints can develop during the thermal reflow process. Akrometrix’s “at-temperature” solutions provide real-time feedback and analysis as to the behavior of substrates and materials in the reflow equipment.
Akrometrix is able to offer a full-field assessment of more than a million data points at any temperature between -50ºC and 300ºC, in less than two seconds, on substrates as large as 600 mm x 600 mm.
- Shadow Moiré
Is a non-contact, full-field optical technique that uses geometric interference between a reference grating and its shadow on a sample to measure relative vertical displacement at each pixel position in the resulting image. If you want to learn more, press here
- Digital Fringe Projection (DFP)
The DFP Module compliments the shadow moiré technique by adding step height measurement capabilities at high data point density. This technique is particularly useful for measurement of connectors, sockets, assembled modules and PCB local areas. If you want to learn more, press here
- Digital Image Correlation (DIC)
Primary use: Measures in-plane strain and displacement of surfaces over temperature. Strain data can be used to calculate average CTE (coefficient of thermal expansion). If you want to learn more, press here
- Studio Platform
Akrometrix Studio is an advanced set of integrated software modules that work together to run all Akrometrix equipment. If you want to learn more, press here