New product release
Yamaha SMT hybrid placer for large PCBs & 12 inch wafers
March 1st Yamaha SMT will release a new Yamaha YRH10w hybrid placer that combines the best from a surface mounter and a die bonder for handling semiconductor chips
The Yamaha YRH10w is a wide-type hybrid placer built on the proven YRH10 platform. It is designed to meet modern SMT requirements, with support for 12-inch wafers and the ability to handle large PCBs and carriers up to L510 × W460 mm. This makes it well suited for production environments where larger formats and stable handling are essential.
By combining the placement accuracy of the YRH10 with Yamaha SMT’s high-speed placement technologies, the YRH10w delivers an impressive bare-chip placement speed of up to 14,000 CPH and a mounting accuracy of ±15 μm when supplied with wafers. The result is fast, precise and repeatable placement - even in demanding production setups.
With a wide range of built-in functions, the YRH10W offers the flexibility needed to support diverse production processes. A single machine that can handle mixed production, modular designs and changing requirements without compromising performance.
Yamaha YRH10w is being shown publicly for the first time at NEPCON JAPAN 2026, taking place in Tokyo from 21–23 January 2026, one of Asia’s leading expos for electronics manufacturing and packaging tech.
Built for power electronics – ready for larger formats
The growing demand for high-efficiency and high-reliability power electronics is placing new requirements on SMT production.
Power modules must be produced with consistent quality, stable processes and high throughput, which puts greater focus on robust mounting solutions and efficient line setups.
At the same time, the semiconductor industry is moving towards 12-inch silicon wafers to reduce component costs and increase production efficiency. This development is now influencing SMT manufacturing, where placement equipment must support larger wafers, larger carriers and more complex production formats.
In power module production, batch mounting is increasingly used to improve efficiency. Multiple circuit boards are arranged on a large carrier and mounted in a single process.
This approach improves throughput and repeatability, but also increases the need for stable handling and transport of large PCBs and carriers within the SMT line.
To meet these requirements, Yamaha SMT has developed the YRH10w hybrid placer. Based on the proven YRH10 platform, the YRH10w combines high placement speed and accuracy with support for 12-inch wafers and large PCB formats. This makes it well suited for power module production, while maintaining the flexibility required for mixed and modular manufacturing.
New Yamaha YRH10w
Discover the new
Yamaha hybrid placer features
High speed, accuracy & quality
The YRH10w combines the precision technologies of the YRH10 - including optimized axis control and thermal compensation - with the high-speed placement expertise developed through Yamaha’s surface mounters.
The result is fast, accurate, and repeatable placement, achieving a bare-chip speed of up to 14,000 CPH and a mounting accuracy of ±15 μm when supplied with wafers.
Height and warpage variations are handled through Mounting Height Compensation and Load Control, ensuring consistent quality even with complex boards. Using the All Image Tracer function, the YRH10w records component recognition images, helping detect potential defects early and maintain optimal mounting quality.
High versatility
The YRH10W supports mixed mounting of both surface-mount devices and wafer components. With compatibility for 6-, 8-, and 12-inch wafers, it can handle multi-die mounting on a single platform.
The machine’s high-rigidity conveyor ensures stable transport and high-accuracy placement for large PCBs up to L510 × W460 × H20 mm.
Additional features, such as the Solder Paste Transfer unit and Fiducial Camera Z-axis Variable function, allow the YRH10W to support diverse production processes, including modular products.
Easy operation
Operation is simple and intuitive.
The Wafer Pickup Condition Setup Utility provides a visual setup for wafer components, allowing quick adjustments without specialized skills.
Placement sequence optimization, cycle time estimation, and other support features help maximize overall equipment performance.
The YRH10w also features the clean, user-friendly interface common to Yamaha’s YR Series platforms, making the machine straightforward to operate while delivering reliable, high-quality results.
Yamaha YRH10w basic specifications
Yamaha YRH10w
Min. L 50 x W 60 mm - max. L 510 x W 460 mm
0.8 - 20.0 mm
Left -► Right
Right -► Left (optional)
Mounting accuracy
± 15μm (μ+ 3a)
* Under Yamaha Motor's optimum conditions
14.000 CPH (when supplied with wafers)
* Under Yamaha Motor's optimum conditions
6 - 12 in. wafers, tape reel
Min. part size: 0.35 mm (when supplied with wafers)
Max. part size:
- Scan camera: 12 mm - H6.5 mm
- Multi-camera: 16 mm - H15 mm
3-phase AC 200/ 208/ 220/ 240/ 380/ 400/ 416V
± 10% 50/ 60 Hz
0.45 MPa or more, clean and dry state
L 1.374 x W 2.602 x H 1.849 mm
2.635 kg
The YRH10w is part of Yamaha’s 1 Stop Smart Solution, where printers, dispensers, surface mounters and inspection systems are designed to work together as one integrated SMT line.
With open communication and no black boxes, data flows smoothly between machines, making it easier to optimize processes, improve uptime and maintain consistent quality.
For SMT manufacturers, this results in a more reliable, scalable & future-ready production setup
- where equipment, software and line integration work together in practice - not just on paper.
New release: Yamaha SMT hybrid placer for large PCBs & 12 inch wafers