Yamaha SMT product news
Yamaha SMT presents new advanced solder paste inspection system for enhanced SMT quality
Explore the sublime SMT production quality and productivity with Yamaha's latest solder paste inspection system
Expect fast high-resolution solder paste inspection with the new Yamaha SPI that uses advanced algorithms in both 2D and 3D modes to enhance focus and contour extraction.
New solder paste inspection includes:
- 3D solder paste and adhesive inspection
- foreign-matter detection
- board warpage compensation
- M2M - Machine 2 machine collaboration with:
- screen printer
- and with component-placement processes.
The SPI system compensates for board warping and handles solder inspection on any PCB. Advanced features include a 360° ring light that ensure reliable inspection and precise three-dimensional measurements.
The streamlined one-head design ensures seamless SPI inspection without interruptions. Choose between 25µm, 20µm, or 15µm lens options, and enjoy the convenience of software controlling multiple inspection resolution switching on each field of view.
This allows for optimal throughput when inspecting boards with varying interconnect density and mixed-size components, including ultra-small 008004” (0201) SMD chips.
Engineered to integrate fully with the complete Yamaha SMT intelligent factory software solution for excellent surface-mount assembly, the VP-01G-Y shares solder paste inspection data machine 2 machine both upstream and downstream within the smt line-up.
The SMT line then responds automatically to setup-change instructions according to the PCB identity, feeds-back inspection results to enhance print quality, and feeds-forward bad-mark data to minimize component-mounting cycle time.
The new Yamaha SPI brings strong data-driven capabilities to surface-mount assembly production within a compact machine footprint of only 938 x 1191 mm.
With a PCB-size range from 50 x 50 mm to 510 x 510 mm, it meets production needs across various EMS and OEM sectors, including automotive, medical, industrial, and consumer electronics manufacturing.