BTU Aurora 125 vacuum reflow oven
Fewer voids. Same steady line flow.
Solder joints with nothing to hide, even under X-ray. The BTU Aurora 125 vacuum reflow oven pulls trapped gas out of each solder joint while the solder is still molten. BTU's vacuum process is designed to bring voiding below 5% (process dependent).
For OEM and EMS manufacturers in Scandinavia and the Baltics, that means better heat transfer, more reliable joints and fewer boards flagged at X-ray inspection. It's especially relevant for QFNs, power modules, LED boards and other assemblies with large thermal pads.
Radiant heaters inside the vacuum chamber let you reach the reflow peak in the chamber itself. Time above liquidus stays short, just like a profile on a standard reflow oven. And because the oven is built on the Aurora platform, you get all the latest Aurora features too.
Total length 7.255 mm | Software & advanced options >
More BTU Aurora 125 vacuum reflow oven info
Specifications for the BTU Aurora 125 vacuum reflow oven:
- Atmosphere: nitrogen or air, with programmable switching between them
- Heating zones before vacuum: 10 top and 10 bottom (forced convection)
- Vacuum chamber heating: 3 top convection zones outside the chamber, plus 2 radiant heaters inside it
- Cooling zones after vacuum: 4 (water-cooled forced convection)
- Maximum temperature:
- 350°C (process chamber)
- 300°C (vacuum chamber) - Temperature uniformity:
- within 4°C across the belt in the reflow zone - Lifetime warranty on heaters and blowers in the convection heating modules
- Heating length: 4.380 mm (incl. vacuum chamber)
-
Cooling length: 1.264 mm
-
Vacuum chamber
- max. PCB size in vacuum: 620 x 711 mm - Vacuum level: 20 Torr (5 Torr optional)
- Pump-down: 15–25 s
hold time: 0–60 s
re-pressurisation: under 8 s - Vacuum soft start to keep components in place
-
Reflow oven size:
L 7.255 x W 1.905 x H 1.596 mm
See software and options for the Aurora platform. Download the datasheet or contact our sales team to find the right configuration for your line.
Voids form when gas from flux or oxidised solder paste gets trapped in the joint. They're most common under thermal pads, which are exactly where heat needs to get out. With vacuum reflow, the gas is removed before the solder sets.
- Reach peak temperature under vacuum: radiant heaters inside the chamber keep your profile close to the one you know from standard reflow.
- Room for large boards, or two lanes: the 620 x 711 mm vacuum chamber fits large-format PCBs or runs two lanes side by side for higher throughput.
- Gentle on sensitive assemblies: soft-start vacuum and a low-vibration transport keep components where you placed them.
Learn more about BTU reflow ovens or compare with the BTU Aurora 125 without vacuum.
Aurora vacuum chamber inside the reflow oven.
BTU reflow oven with the vacuum chamber up.
Get the full specs for the Aurora 125 vacuum reflow oven
The datasheet covers vacuum performance, chamber size and standard features in one place, so it's handy when you're comparing options or briefing your production team.
Let's talk voids, volumes and the Aurora 125 vacuum reflow oven
Wondering if vacuum reflow will fix your voiding issues, or how the oven fits your line and floor space? Peter can help with configuration, availability and pricing.